Realme, the sub-brand of OPPO, one of the most popular brands of BBK Holding, wants to manage the company and the audience in a short time. MediaTek, which we said to be working on new chips in the previous news, is expected to launch the world’s first chip with 6nm production process soon, while the first device to use the new chip has gradually become apparent. realme X9 Pro is the first phone to be powered by the new Dimensity 1200!
Currently, the upper segment mobile chip market blended with 7nm and 5nm chips; It witnesses the rivalry between Apple, Qualcomm, Exynos and Kirin. Although we see MediaTek inspirations in the middle and entry segment, the company, which has not yet been able to offer competitive chips in the upper segment, winked with the Dimensity series. The company, which shows that both cheap and powerful devices can be made especially with Dimensity 1000+, will present the first 6nm chip in the realme X9 Pro model.
Dimensity 1200, which comes with an eight-core structure, consists of 1 Cortex-A78 running at 3.0GHz and 3 at 2.6GHz. The remaining 4 cores appear as Cortex-A55 running at 2.0GHz. The chip also brings 5G support and offers Mali-G77 MC9 on the GPU side.
realme X9 Pro comes with a high-end hardware such as a 6.4 inch OLED display with 1080 × 2400 pixel FHD + resolution with 120Hz scanning speed, 8GB / 12GB RAM, 128GB / 256GB storage, 108Mp triple camera, 65W fast charging supported 4,500 mAh battery.