In previous years, many companies have tried 3D smartphones, but they have not been successful and have disappeared from the smartphone market. Brands that ambitiously entering the smartphone market such as HTC Evo 3D and LG Optimus 3D could not meet the expectations. Now Xiaomi has patented a 3D smartphone and started working on a new product. The phone in the patent has a very different design.

 

 

How will Xiaomi 3D smartphone specifications be

The company, which applied for a patent last month, was approved and published on February 5, 2021. The smartphone comes in a quite different design. There are four cameras on the back of the device. The camera array has a very different sequence from smartphones on the market. It is placed in each corner of the device. On the front, it has an appearance without notches, holes or pull-out modules. The phone is expected to come with an under-screen camera. There is a volume and power button on the right side of the phone. On the left is the SIM card slot. At the bottom of the device, there are USB Type-C port, 3.5mm headphone jack, holes for microphone and speaker.

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Although 3D technology is not used in smartphones today, the Chinese smartphone manufacturer can be successful in this regard by bringing a different perspective to smartphones.

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